Heater assembly and a heat-treatment method of semiconductor waf

Details Heater assembly and a heat-treatment method of semiconductor waf Heater assembly and a heat-treatment method of semiconductor waf

1983-10-06

1985-08-13

Envall, Jr., Roy N.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219405, 219354, 118725, F27D 1100, H05B 100, C23C 1308

Patent

active

045352283

ABSTRACT:
Disclosed herein are a heater assembly and a method for heat-treating a semiconductor wafer using the same. The heater assembly is formed of a heating device having a ring-shaped portion and a holder combined with the heating device detachably each other. A wafer material such as a semiconductor wafer is held on the holder of the heater assembly. A heat-treatment is effected by heating the wafer material by means of application of light radiated from a light source, which is formed of one or more lamps, while heating or after having heated the circumferential portion of the wafer by the heating device of the heater assembly. Owing to the subsidiary heating of the circumferential portion, the wafer may be heat-treated at substantially the same temperature in its entirety. Thus, the heat-treatment does not develop such large "warping" impairing subsequent treatment and/or treatment of the wafer or "slip lines". The heater assembly may be used successfully and conveniently in effecting uniform heating. The detachable structural feature of the holder facilitates its cleaning and this is effective in keeping the atmosphere of the irradiation space always clean.

REFERENCES:
patent: 983292 (1911-02-01), Kohn
patent: 3395266 (1968-07-01), Price
patent: 3471326 (1969-10-01), Kappelmeyer
patent: 3539759 (1970-11-01), Spiro
patent: 3836751 (1974-09-01), Anderson
patent: 4101759 (1978-07-01), Anthony
patent: 4113547 (1978-09-01), Katz
patent: 4339645 (1982-07-01), Miller

Affiliated with

Also associated with

Rating

Heater assembly and a heat-treatment method of semiconductor waf does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heater assembly and a heat-treatment method of semiconductor waf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heater assembly and a heat-treatment method of semiconductor waf will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2319693