Heated medium supplying method and structure for secondary...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C264S328140, C425S547000

Reexamination Certificate

active

07459118

ABSTRACT:
A hot-air supply structure (1) comprises a hot air generator (20) and a housing (15) formed in the neighborhood of a hot-air inlet (81) of a molded component M in a die (10). A nozzle (21) is formed at the forward end of the hot-air generator, and an ejection port (211b) is formed on the side wall portion of the forward end needle unit (211) of the nozzle. The housing includes a support hole (151) in the nozzle, a relief hole (152), a flow path communication passage (153) and a bypass (154). The ejection port is movable between a first position to discharge the cool or warm air into the atmosphere through the bypass from the relief hole and a second position to introduce hot air into the flow path (8) of the molded component through the inlet (81) and the passage (153).

REFERENCES:
patent: 4746384 (1988-05-01), Tan
patent: 7300274 (2007-11-01), Nasu et al.
patent: 2005/0212176 (2005-09-01), Nasu et al.
patent: 302 447 (1972-10-01), None
patent: 38 51 567 (1988-04-01), None
patent: 102 59 031 (2003-07-01), None
patent: 676543 (1952-07-01), None
patent: 1128878 (1968-10-01), None
patent: 62-87315 (1987-04-01), None
patent: 4-91914 (1992-03-01), None
patent: 6-238707 (1994-08-01), None
patent: 9-104014 (1997-04-01), None
patent: 2003-245980 (2003-09-01), None
Office Action dated Aug. 20, 2008 in German Application No. 10 2005 012 995.1 with English translation therof.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heated medium supplying method and structure for secondary... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heated medium supplying method and structure for secondary..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heated medium supplying method and structure for secondary... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4044005

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.