Heated circuit assembly tester and method

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36446824, 73814, G06F 1900

Patent

active

059496827

ABSTRACT:
A heated unit for testing circuit board assemblies. An insulated enclosure receives card assemblies to be tested through a door. A heater within the enclosure heats the card assemblies at a constant regulated temperature. A motor separately applies angular displacement to the card assemblies which are held in a fixture to stress solder joints between a card substrate and components on the card substrate. The angular displacement is maintained at a predetermined amplitude during tests providing a controlled repeatable stress for the components, which may be repeated between batches of the circuit cards being tested.

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