Heated chuck for laser thermal processing

Details Heated chuck for laser thermal processing Heated chuck for laser thermal processing

2004-12-01

2010-06-08

Heinrich, Samuel M (Department: 3742)

Coating apparatus

Gas or vapor deposition

With treating means

C118S059000, C156S345520, C156S345530, C219S443100, C219S446100, C219S448110

Reexamination Certificate

active

07731798

ABSTRACT:
A chuck for supporting a wafer and maintaining a constant background temperature across the wafer during laser thermal processing (LTP) is disclosed. The chuck includes a heat sink and a thermal mass in the form of a heater module. The heater module is in thermal communication with the heat sink, but is physically separated therefrom by a thermal insulator layer. The thermal insulator maintains a substantially constant power loss at least equal to the maximum power delivered by the laser, less that lost by radiation and convection. A top plate is arranged atop the heater module, supports the wafer to be processed, and provides a contamination barrier. The heater module is coupled to a power supply that is adapted to provide varying amounts of power to the heater module to maintain the heater module at the constant background temperature even when the wafer experiences a spatially and temporally varying heat load from an LTP laser beam. Thus, heat from the laser is transferred from the wafer to the heat sink via the heater module and the insulator layer. In the absence of any laser heating, heat is also transferred from the heater module to the wafer as needed to maintain the constant background temperature.

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