Heatable ice cream scooping implement

Plastic article or earthenware shaping or treating: apparatus – Means excavating from a bulk source with simultaneous shaping – Including means to aid separation of shape product from bulk

Reexamination Certificate

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Details

C425S276000, C425S277000, C425S278000, C425S280000, C425S281000, C425S282000, C425S283000, C425S284000, C425S285000, C425S286000, C425S187000, C425S221000, C070S174000, C070S192000, C070S432000, C285S007000, C285S317000, C285S921000

Reexamination Certificate

active

07427194

ABSTRACT:
An ice cream scooping implement includes an elongated handle that has an axial bore extending from a handle distal end and terminates approximately midway therealong. The handle has an end cap removably mated to a proximal end thereof. A scooping section is telescopically and removably insertable into the axial bore and includes a mechanism for locking the scooping section within the handle. A heating element is concentrically seated about a proximal portion of the scooping section, is in direct contact with the scooping section, is isolated from the handle, and is formed from thermal-conductive and electrical-conductive material, including tungsten. The heating element includes a pair of conductive terminals that extend proximally along a longitudinal length thereof. A mechanism is included for supplying power to the heating element. The terminals are directly engaged with the power supplying mechanism.

REFERENCES:
patent: 1906131 (1933-04-01), Baylis
patent: 2502105 (1950-03-01), Segal
patent: 3513290 (1970-05-01), Burley et al.
patent: 4553921 (1985-11-01), Lamphere et al.
patent: D305852 (1990-02-01), Clement et al.
patent: 5000672 (1991-03-01), Halimi
patent: 5044914 (1991-09-01), Schulling
patent: 6416309 (2002-07-01), Michlitsch et al.
patent: 6431607 (2002-08-01), Kittelmann et al.
patent: D490666 (2004-06-01), Gordon
patent: 2640866 (1990-06-01), None
patent: 2388300 (2003-11-01), None
Brandt, Lutz et al., “Conducting Materials” in Wiley Encyclopedia of Electrical and Electronics Engineering, Dec. 27, 1999, pp. 81-82.

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