Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized
Reexamination Certificate
2003-08-08
2009-12-01
Meeks, Timothy H (Department: 1792)
Coating processes
Coating by vapor, gas, or smoke
Mixture of vapors or gases utilized
Reexamination Certificate
active
07625604
ABSTRACT:
The present invention relates to a thermal processing method includes a first thermal processing step that carries out thermal processing steps using a plurality of first substrates, wherein thin films are formed on surfaces of the plurality of first substrates by means of less consumption of the process gas than on surfaces of production substrates. Then, a second thermal processing step carries out thermal processing steps by using a plurality of second substrates, wherein thin films are formed on surfaces of the plurality of second substrates by means of more consumption of the process gas than on the surfaces of the plurality of first substrates, and wherein heating units are respectively adjusted to respective temperature set values set during the previous step. Then, a third thermal processing step carries out thermal processing steps by using production substrates as the plurality of substrates, wherein the plurality of heating units are respectively adjusted to the respective temperature set values corrected during the previous step.
REFERENCES:
patent: 5863602 (1999-01-01), Watanabe et al.
patent: 6211094 (2001-04-01), Jun et al.
patent: 2002/0001788 (2002-01-01), Sakamoto et al.
patent: 2002/0014483 (2002-02-01), Suzuki et al.
patent: 2003/0162372 (2003-08-01), Yoo
patent: 2000-091251 (2000-03-01), None
patent: 2000-340554 (2000-12-01), None
patent: 2001-077041 (2001-03-01), None
patent: 2002-025997 (2002-01-01), None
patent: 2002-043300 (2002-02-01), None
patent: 2002-141347 (2002-05-01), None
Supplementary European Search Report, issued in connection with EP 03 78 4632, dated Jan. 31, 2007.
English translation of the International Preliminary Examination Report dated Aug. 17, 2004, International Application No. PCT/JP2003/010173.
Ikeuchi Toshiyuki
Sato Toru
Suzuki Keisuke
Wang Wenling
Yonekawa Tsukasa
Burkhart Elizabeth
Meeks Timothy H
Smith , Gambrell & Russell, LLP
Tokyo Electron Limited
LandOfFree
Heat treatment method and heat treatment apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat treatment method and heat treatment apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat treatment method and heat treatment apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4145025