Heat-treatment member for semiconductor elements

Details Heat-treatment member for semiconductor elements Heat-treatment member for semiconductor elements

1988-05-27

1990-02-27

Robinson, Ellis P.

Stock material or miscellaneous articles

Nonparticulate element embedded or inlaid in substrate and...

428 76, 428333, 428446, 428698, 118500, 422248, 422249, B44C 126

Patent

active

049045156

ABSTRACT:
A semiconductor element heat-treatment member has a Si-SiC body and a SiO.sub.2 coating formed on the surface of the Si-SiC body so as to cover the Si-SiC body. The SiO.sub.2 coating has a thickness ranging between 20.ANG. and 100,000.ANG..

REFERENCES:
patent: 3634116 (1972-01-01), Woerner et al.
patent: 3951587 (1976-04-01), Alligro et al.
patent: 4499147 (1985-02-01), Epomoto et al.
patent: 4710428 (1987-12-01), Tamamizu et al.
patent: 4767666 (1988-08-01), Bunshah et al.
patent: 4781970 (1988-11-01), Bachee et al.
patent: 4804589 (1989-02-01), Matsui et al.

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