Heat treatment jig for semiconductor silicon substrate

Heating – Accessory means for holding – shielding or supporting work... – Support structure for heat treating ceramics

Reexamination Certificate

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C432S258000, C211S041180

Reexamination Certificate

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07442038

ABSTRACT:
This invention provides a heat treatment jig for semiconductor silicon substrates, which, in respective heat treatment of hydrogen annealing or argon annealing, can handle enlargement of the diameter of wafers to be treated and can also prevent slipping and dislocations that occur as a result of the stress caused by the weight of the wafer itself or the deflection of the heat treatment jig itself.

REFERENCES:
patent: 2233434 (1941-03-01), Smith
patent: 2273475 (1942-02-01), Schreiber
patent: 5669513 (1997-09-01), Oh et al.
patent: 5718574 (1998-02-01), Shimazu
patent: 5820367 (1998-10-01), Osawa
patent: 6375749 (2002-04-01), Boydston et al.
patent: 6474987 (2002-11-01), Nakai et al.
patent: 6544340 (2003-04-01), Yudovsky
patent: 6576064 (2003-06-01), Griffiths et al.
patent: 6962477 (2005-11-01), Tateyama et al.
patent: 7163393 (2007-01-01), Adachi
patent: 7217395 (2007-05-01), Sander
patent: 7311779 (2007-12-01), Nguyen et al.
patent: 2003/0170583 (2003-09-01), Nakashima et al.
patent: 2006/0180084 (2006-08-01), Blomiley et al.
patent: 05-152228 (1993-06-01), None
patent: 06-151347 (1994-05-01), None
patent: 2001-060559 (2001-03-01), None
patent: 2001-102318 (2001-04-01), None
patent: 2003-37112 (2003-02-01), None
Patent Abstracts of Japan for JP06-151347 published on May 31, 1994.
Patent Abstracts of Japan for JP2001-102318 published on Apr. 13, 2001.
Patent Abstracts of Japan for JP2001-060559 published on Mar. 6, 2001.
Patent Abstracts of Japan for JP05-152228 published on Jun. 18, 1993.
Patent Abstracts of Japan for JP2003-037112 published on Feb. 7, 2003.

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