Heat treatment for edges of multilayer semiconductor wafers

Details Heat treatment for edges of multilayer semiconductor wafers Heat treatment for edges of multilayer semiconductor wafers

2005-02-08

2005-02-08

Fuqua, Shawntina (Department: 3742)

Electric resistance heating devices

Heating devices

Radiant heater

C392S418000, C219S390000, C219S405000, C219S411000, C118S724000, C118S725000

Reexamination Certificate

active

06853802

ABSTRACT:
A method for heat treating a multilayer semiconductor wafer having a central region and a peripheral edge each having a surface. The method includes thermally treating selected portions of the peripheral edge to compensate for local differences in heat absorption. This establishes a substantially equivalent temperature over both the surface of the central region and the surface of the peripheral edge to prevent the appearance of slip lines on those surfaces.

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Timans et al., “Handbook of semiconductor manufacturing technology”, p. 224.

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