Heat treatment apparatus, heat treatment method, and...

Details Heat treatment apparatus, heat treatment method, and... Heat treatment apparatus, heat treatment method, and...

2011-05-24

2011-05-24

Kastler, Scott (Department: 1733)

Metallurgical apparatus

With control means responsive to sensed condition

With means responsive to condition of treated material

C266S099000, C118S708000

Reexamination Certificate

active

07947215

ABSTRACT:
An experiment is conducted in advance, for finding a temperature of a cooling plate attained as a result of balancing between a temperature of a substrate after heat treatment and a temperature of the cooling plate at the time of cooling of the substrate. Then, before heat treatment of a first substrate, the cooling plate is moved to a position above a hot plate, the cooling plate is heated to that temperature, and thereafter heat treatment of the substrate is started.

REFERENCES:
patent: 6191394 (2001-02-01), Shirakawa et al.
patent: 2007/0218706 (2007-09-01), Matsuoka
patent: 2007/0286709 (2007-12-01), Fujii et al.
patent: 2000-068176 (A) (2000-03-01), None
patent: 2001-358045 (A) (2001-12-01), None
patent: 2002-93799 (2002-03-01), None
patent: 2003-347305 (2003-12-01), None
Notice of Grounds of Rejection mailed Oct. 19, 2010 in Japanese Patent Appln. No. 2006-122455, drafting date Oct. 13, 2010 (with English langusage translation).

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