Heat treatment apparatus and method thereof

Details Heat treatment apparatus and method thereof Heat treatment apparatus and method thereof

1994-06-28

1996-04-16

Bennett, Henry A.

Heating

With work cooling structure

432 83, 432 84, 432123, 432152, 432239, F27D 1502

Patent

active

055076394

ABSTRACT:
Nozzles that blow an air are disposed in a space between an outer wall of a process tube and a heat generating resistor. The openings of the nozzles are oriented to the process tube corresponding to an arrangement area of semiconductor wafers. An air blowing angle and alignment of the openings of the nozzles are designated corresponding to the length of the arrangement area of the semiconductor wafers. Thus, since a portion where natural heat radiation is weak is forcedly cooled, the cooling effect can become equal in the entire region of the process tube, thereby reducing temperature drop time.

REFERENCES:
patent: 5249960 (1993-10-01), Monoe
patent: 5323484 (1994-06-01), Nakao et al.
English language Abstract of JP 59-61120(A).

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