Heat treatment apparatus and method for heating substrate by...

Details Heat treatment apparatus and method for heating substrate by... Heat treatment apparatus and method for heating substrate by...

2009-04-15

2011-10-18

Robinson, Daniel L (Department: 3742)

Electric resistance heating devices

Heating devices

Radiant heater

C118S725000, C219S405000

Reexamination Certificate

active

08041198

ABSTRACT:
In photo-irradiation heating with a total photo-irradiation time of one second or less, after initial photo-irradiation of a semiconductor wafer is performed while increasing an emission output to a target value, succeeding photo-irradiation of the semiconductor wafer is performed while maintaining the emission output within a range of plus or minus 20% from the target value. The photo-irradiation time for the initial photo-irradiation ranges from 0.1 to 10 milliseconds, and the photo-irradiation time for the succeeding photo-irradiation ranges from 5 milliseconds to less than one second. This allows the temperature of the semiconductor wafer even at a somewhat greater depth below the surface to be raised to some extent while allowing the surface temperature to be maintained at a generally constant processing temperature, thus achieving both the activation of implanted ions and the repair of introduced defects without any thermal damage to the semiconductor wafer.

REFERENCES:
patent: 6936797 (2005-08-01), Hosokawa
patent: 6998580 (2006-02-01), Kusuda et al.
patent: 7183229 (2007-02-01), Yamanaka
patent: 7381928 (2008-06-01), Kusuda et al.
patent: 7616872 (2009-11-01), Camm et al.
patent: 2009/0103906 (2009-04-01), Kusuda
patent: 2009/0166351 (2009-07-01), Yokomori
patent: 2009/0263112 (2009-10-01), Kiyama et al.
patent: 2009/0285568 (2009-11-01), Kiyama et al.

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