Heat treatment apparatus and heat treatment method

Electric resistance heating devices – Heating devices – Radiant heater

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392416, 219405, 219390, 432241, 432152, 118724, 118725, F26B3/30;19/00

Patent

active

059037113

ABSTRACT:
A wafer to be heat-treated is placed in a heat treatment chamber defined by a heat treatment vessel, and the wafer is heat-treated by radiant heat radiated by a heat source. A gas is supplied through a gas passage formed along the outer surface of an inner wall of the heat treatment vessel and having a portion extending near the heat source. The gas heated in the portion of the gas passage extending near the heat source by the heat source is blown toward a substantially central portion of the wafer as complementary heating means for increasing the temperature of the central portion of the wafer.

REFERENCES:
patent: 5148714 (1992-09-01), McDiarmid
patent: 5156820 (1992-10-01), Wong et al.
patent: 5308955 (1994-05-01), Watanabe
patent: 5444217 (1995-08-01), Moore et al.
patent: 5453124 (1995-09-01), Moslehi et al.
patent: 5482559 (1996-01-01), Imai et al.
patent: 5536918 (1996-07-01), Ohkase et al.
patent: 5567152 (1996-10-01), Morimoto
patent: 5632820 (1997-05-01), Taniyama et al.
Japanese Publication, JP 405152225 A, Jun. 1993.

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