Heat treatment apparatus and heat treatment boat

Heating – Accessory means for holding – shielding or supporting work... – Support structure for heat treating ceramics

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Details

432253, 432241, 432 5, 432 6, 211 4118, F27D 500

Patent

active

060332158

ABSTRACT:
A heat treatment boat houses a plurality of semiconductor wafers in a manner separated at intervals for heat-treating the wafers in a heat treatment furnace. The heat treatment boat includes a bottom plate, a first support rod erected on the outer peripheral edge of the bottom plate, a second support rod and a third support rod both erected on the bottom plate so as to make an central angle of 105.degree. to 120.degree. with the first support rod with respect to the center of the respective wafer supported by the rods, and a top plate provided opposed to the bottom plate for holding the rods. The stresses applied to the wafers housed in the heat treatment boat are distributed equivalently to three contacting points with the rods and become the minimum.

REFERENCES:
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patent: 4872554 (1989-10-01), Quernemoen
patent: 5044752 (1991-09-01), Thurfjell
patent: 5054418 (1991-10-01), Thompson et al.
patent: 5055036 (1991-10-01), Asano et al.
patent: 5297956 (1994-03-01), Yamabe et al.
patent: 5310339 (1994-05-01), Ushikawa
patent: 5316472 (1994-05-01), Niino et al.
patent: 5445486 (1995-08-01), Kitayama et al.
patent: 5540782 (1996-07-01), Miyagi et al.
patent: 5586880 (1996-12-01), Ohsawa

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