Heat treatment apparatus

Coating apparatus – Gas or vapor deposition – With treating means

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Details

118715, 118728, 118729, C23C 1600

Patent

active

059976519

ABSTRACT:
A heat treatment apparatus includes a treatment container having a reaction chamber, and a gas chamber a mount table provided in the treatment container for mounting thereon a wafer such that an upper surface of the wafer is exposed to the reaction chamber, and an annular clamp member provided in the reaction chamber, movable between a clamp position in which it contacts the peripheral edge of the wafer in circular line contact and a waiting position in which it is separated from the wafer. The line contact prevents leakage of the process gas from the reaction chamber through a clearance between the clamp member and the wafer.

REFERENCES:
patent: 5292554 (1994-03-01), Sinha
patent: 5304248 (1994-04-01), Cheng et al.
patent: 5574247 (1996-11-01), Nishitani
patent: 5635244 (1997-06-01), Maeda
patent: 5711815 (1998-01-01), Lee

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