Heat-treatment apparatus

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Details

432156, 432 11, 432253, F27D 312

Patent

active

054073502

ABSTRACT:
A heat-treatment apparatus comprises a heat-treatment section for subjecting a heat-treatment to a wafer and a loading section for loading a wafer boat into and unloading it from the heat-treatment section. The loading section is connected to the heat-treatment section and includes in it a movable support member, a drive mechanism and a vertical base board as well as a load-lock chamber for maintaining the inside in vacuum. The movable support member supports a wafer boat. The movable support member is attached to a vertical base board so that it can move up and down. The drive mechanism is attached on the major surface of the vertical base board opposite to the surface facing the wafer boat. The drive mechanism drives the movable support to move up and down. The heat-treatment apparatus further comprises a wafer transfer section that includes an orientation flat alignment mechanism and a buffer stage disposed near the orientation flat alignment mechanism. The wafer transfer section includes a wafer cassette means, a buffer stage and a wafer transfer robot for transferring wafers between the orientation flat alignment mechanism and the wafer boat.

REFERENCES:
patent: 5116784 (1992-05-01), Ushikawa
patent: 5207578 (1993-05-01), Sakata
patent: 5271732 (1993-12-01), Yokokawa
patent: 5273423 (1993-12-01), Shiraiwa

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