Heat treating device

Details Heat treating device Heat treating device

1994-06-10

1995-12-26

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118715, 118725, C23C 1600

Patent

active

054783976

ABSTRACT:
A heat treating device including a processing vessel for exposing objects to be treated (e.g., semiconductor wafers) held in a wafer boat for a heat treatment, processing gas introduction nozzles for introducing processing gases, a cap for openably closing tightly an opening of the processing vessel; a heat retention cylinder on which the boat is mounted; and a gas introduction opening, a gas passage, and a gas release opening opened in the heat retention cylinder. Processing gases introduced from the introduction nozzles are taken into the heat retention cylinder through the gas introduction opening and released radially from the gas release opening in the top thereof. The heat retention cylinder has the function of introducing the processing gases, whereby high intra-plane film thickness uniformity can be retained without rotating the wafer boat.

REFERENCES:
patent: 5029554 (1991-06-01), Miyashita
patent: 5146869 (1992-09-01), Bohannon
patent: 5273586 (1993-12-01), Kim
patent: 5279670 (1994-01-01), Watanabe
patent: 5308955 (1994-05-01), Watanabe
patent: 5320680 (1994-06-01), Learn
patent: 5370371 (1994-12-01), Miyagi

Affiliated with

Also associated with

Rating

Heat treating device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat treating device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat treating device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1366002