Heat treating apparatus

Details Heat treating apparatus Heat treating apparatus

2011-01-04

2011-01-04

Campbell, Thor S (Department: 3742)

Electric resistance heating devices

Heating devices

Radiant heater

C392S418000, C392S391000

Reexamination Certificate

active

07865070

ABSTRACT:
To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing.The heat treating apparatus includes a processing chamber for heat treating wafers and a boat for supporting the wafers in the processing chamber. The boat further includes a wafer holder in contact with the wafer and a main body for supporting the wafer holder. The wafer holder diameter is 63 to 73 percent of the wafer diameter, and the surface roughness Ra of the portion of the wafer holder in contact with the wafer is set from 1 μm to 1,000 μm. The wafer can be supported so that the amount of wafer displacement is minimal and both slips due to damage from projections on the wafer holder surface, and slips due to the adhesive force occurring because of excessive smoothing can be prevented in that state.

REFERENCES:
patent: 08-070034 (1996-03-01), None
patent: 10-340896 (1998-12-01), None
patent: 2002-124519 (2002-04-01), None
patent: 2003-289027 (2003-10-01), None
Iwao Nakamura et al.: “Development of Ultrahigh Temperature Anneal Technology”, Hitachi Kokusai Electric Technical Journal, 2003, No. 4, Mar. 2004 with English translation (37 pages).

Affiliated with

Also associated with

Rating

Heat treating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat treating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat treating apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2726019