Heat treating apparatus

Details Heat treating apparatus Heat treating apparatus

1990-07-16

1992-02-18

Kastler, S.

Metallurgical apparatus

Means treating solid metal

Having evacuated chamber

20429836, C21D 174

Patent

active

050886975

ABSTRACT:
A susceptor is located in a treating space of a CVD apparatus with a wafer placed in contact with a first surface of a susceptor. The susceptor is heated by a heating source to impart the heat to the wafer. A treating gas is supplied into a treating space and decomposed in a course of a reaction to form a film on the wafer. A guard ring is located on a second surface of the susceptor which is situated around the first surface of the susceptor. The guard ring and wafer are heated by the susceptor in the same way. The surface of the susceptor is substantially not exposed between the guard ring and the wafer and a temperature on the exposed surface of the guard ring and that on the exposed surface of the wafer are nearly equal to each other.

REFERENCES:
patent: 3341371 (1967-09-01), Baumgartner
patent: 4195820 (1980-04-01), Berg
patent: 4795529 (1989-01-01), Kawasaki et al.

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