Heat transforming arrangement for printed wiring boards

Details Heat transforming arrangement for printed wiring boards Heat transforming arrangement for printed wiring boards

1994-08-17

1995-05-09

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 211 41, 361719, 361796, H05K 720

Patent

active

054145929

ABSTRACT:
In the present invention, a heat transferring arrangement is disclosed for a printed wiring board assembly. A heat conductive panel is provided to be in close proximity to a component side of a printed wiring board. The heat conductive panel further includes flange members, so that the flange members may be forced against a heat conducting surface of a chassis and provide a thermally conductive contact therewith. With this arrangement, heat transfer by radiation from the circuit components to the heat conductive panel is enhanced and thereby permits heat transfer by conduction from the heat conductive panel to the chassis.

REFERENCES:
patent: 4441140 (1984-04-01), Richard
patent: 4867235 (1989-09-01), Grapes
patent: 4994937 (1991-02-01), Morrison
patent: 5057968 (1991-10-01), Morrison
patent: 5184281 (1993-02-01), Samarov
patent: 5224016 (1993-06-01), Weisman
patent: 5287248 (1994-02-01), Montesano

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