Heat transfer system, method, and computer program product...

Details Heat transfer system, method, and computer program product... Heat transfer system, method, and computer program product...

2011-06-28

2011-06-28

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S719000, C361S721000, C174S015100, C174S016100, C165S080300, C165S080400, C165S104330

Reexamination Certificate

active

07969733

ABSTRACT:
A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.

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