Heat transfer surface for electronic cooling

Details Heat transfer surface for electronic cooling Heat transfer surface for electronic cooling

2011-01-04

2011-01-04

Leo, Leonard R (Department: 3744)

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

C165S080400, C165S133000, C165S185000, C361S700000

Reexamination Certificate

active

07861408

ABSTRACT:
A cooling surface for cooling an electronic component, the surface having two sets of fins, each set of fins defining a set of channels, and a number of passageways connecting the sets of channels. The cooling surface can be attached to an electronic component, such as a chip, and refrigerant supplied to at least one of the sets of channels. When the temperature of the electronic component rises, the heat is transferred to the refrigerant in the cooling surface, at least some of which vaporizes to carry heat away from, and facilitate cooling of, the component.

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Micro Deformation Technology (MDT) slide show, Wolverine Tube, Inc., www.wlv.com/mdt/Micro%20Deformation%20Technology—files/slide0188htm, Jul. 2002.

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