Heat transfer sub-assembly incorporating liquid metal surrounded

Details Heat transfer sub-assembly incorporating liquid metal surrounded Heat transfer sub-assembly incorporating liquid metal surrounded

1995-09-21

1996-10-01

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 165185, 165907, 257714, 361704, H05K 720

Patent

active

055615902

ABSTRACT:
A sub-assembly for transferring heat between a heat generating unit and heat receiving unit which are separated by a gap, comprises: a compliant body having microscopic voids therethrough; a liquid metal alloy that is absorbed in the microscopic voids in the compliant body; a seal ring which surrounds the compliant body; and, a retaining member which is attached to the compliant body and the seal ring, and which holds the compliant body spaced apart from the seal ring. This sub-assembly is placed in the gap between the two units and compressed to the point where liquid metal alloy is squeezed out of the compliant body. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body. Also in the sub-assembly, the retainer holds the compliant body in an easily replaceable fashion; and this becomes important when the heat generating unit needs to be replaced.

REFERENCES:
patent: 2946681 (1960-07-01), Probst et al.
patent: 3694699 (1972-09-01), Snyder et al.
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4381818 (1983-05-01), Sachar et al.
patent: 4823863 (1989-04-01), Nakajima et al.
patent: 5323294 (1994-07-01), Layton et al.
patent: 5459352 (1995-10-01), Layton et al.

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