Heat transfer sheet, heat transfer structural body and...

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making

Reexamination Certificate

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Details

C165S146000, C165S185000, C165S905000, C361S704000

Reexamination Certificate

active

07610678

ABSTRACT:
A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

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Office Action from Japan Patent Office regarding Application No. 2004-239960 dated Aug. 7, 2007, with English Translation and Certification and Prior Art Information List.
Office Action from Japan Patent Office regarding Application No. 2004-239960 dated Aug. 7, 2007 with English Translation.

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