Compositions – Heat-exchange – low-freezing or pour point – or high boiling... – Organic components
Patent
1987-11-23
1989-01-31
Page, Thurman K.
Compositions
Heat-exchange, low-freezing or pour point, or high boiling...
Organic components
252 71, 252 74, C09K 500
Patent
active
048013943
ABSTRACT:
A heat transfer promoter composition comprises a triazine-dithiol derivative represented by the general formula ##STR1## wherein R represents --NHR' or --NR'.sub.2 wherein: R' is a hydrocarbon group; M is selected from the group consisting of hydrogen, alkali metals, and alkaline earth metals; and at least one of M groups is alkaline metal or alkaline earth metal. This heat transfer promotor is applied to that surface of a condenser tube to be contacted by a vapor to be condensed.
REFERENCES:
patent: 4193480 (1980-03-01), Press
patent: 4246057 (1981-01-01), Janowski et al.
patent: 4296539 (1981-10-01), Asami
patent: 4354550 (1982-10-01), Modahl et al.
patent: 4358485 (1982-11-01), Kern et al.
patent: 4368776 (1983-01-01), Negita et al.
patent: 4421789 (1983-12-01), Kaneko et al.
L. C. F. Blackman et al., "An Investigation of Compounds Promoting The Dropwise Condensation of Steam", J. Appl. Chem. Apr. 7, 1957, pp. 161-171.
L. A. Bromley et al., "Promotion of Drop-by-Drop Condensation of Steam From Seawater on a Vertical Copper Tube", ALChE Journal, vol. 14, No. 2, Mar. 1968, pp. 245-250.
Chemical Abstracts, 101 (4) 25,156x (1984).
Chemical Abstracts, 92 (20) 165,376q (1980).
Miyazaki Matsuo
Mochida Yoshio
Mori Kunio
Nakamura Yoshiro
Okumura Minoru
Kabushiki Kaisha Toshiba
Mori Kunio
Nakamura Yoshiro
Page Thurman K.
LandOfFree
Heat transfer promoters and method of using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat transfer promoters and method of using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat transfer promoters and method of using the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-176469