Heat transfer pad decoration and substrates therefore

Details Heat transfer pad decoration and substrates therefore Heat transfer pad decoration and substrates therefore

1985-09-09

1986-09-09

Kimlin, Edward

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156240, 156249, 1563309, 156344, 156320, 156321, 156493, 428 40, 428914, B32B 3100, B65C 925, C09J 506, A61F 1302

Patent

active

046107444

ABSTRACT:
A decorative laminate and method of transferring designs onto articles. The laminate is formed of a transfer substrate affixed to a support member. The transfer substrate is composed of a protective layer, an ink layer, and a nonwax-based adhesive/release layer. The adhesive/release layer is in direct contact with the support member and use of a wax layer intermediate the adhesive/release layer and the support is excluded. Optionally, a barrier layer is provided between the adhesive/release layer and the ink layer. In many applications the protective coating layer may be omitted. The laminate is applied to an article using a heated silicone rubber transfer pad to which the transfer substrate adheres during the transfer process.

REFERENCES:
patent: 3379604 (1968-04-01), Weber et al.
patent: 3436293 (1969-04-01), Newman
patent: 3616176 (1971-10-01), Jachimowicz
patent: 3847697 (1974-11-01), Baker et al.
patent: 3887420 (1975-06-01), Weingrad
patent: 3899379 (1975-08-01), Wanesky
patent: 4068033 (1978-01-01), Meade
patent: 4211810 (1980-07-01), Barta
patent: 4251276 (1981-02-01), Ferree, Jr. et al.
patent: 4303717 (1981-12-01), Andrews
patent: 4426422 (1984-01-01), Daniels

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