Heat transfer of processing systems

Details Heat transfer of processing systems Heat transfer of processing systems

2011-08-30

2011-08-30

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C361S719000, C361S720000, C257S686000

Reexamination Certificate

active

08009420

ABSTRACT:
A processing module may be provided. The processing module may include a mounting member configured to structurally support a first processing unit and receive thermal energy from the first processing unit through a coupling side of the first processing unit by conduction. The processing module may also include a base member coupled to the mounting member. The base member may be configured to receive thermal energy from the mounting member. A thermal conductivity of at least one of the mounting member and the base member may be greater than about 50 Watts/meter Celsius (W/m-C). Coefficients of thermal expansion (CTEs) of the mounting member, the base member, and the coupling side of the first processing unit may be matched.

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