Heat transfer module incorporating liquid metal squeezed from a

Details Heat transfer module incorporating liquid metal squeezed from a Heat transfer module incorporating liquid metal squeezed from a

1995-09-21

1996-11-05

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 165185, 165907, 257714, 361704, H05K 720

Patent

active

055724043

ABSTRACT:
A heat transfer module, comprises: a heat generating unit and a heat receiving unit which are separated by a gap; a compliant body, having microscopic voids therethrough, which is compressed into the gap; and a liquid metal alloy that is absorbed in the microscopic voids in the compliant body. Further, the heat transfer module also includes a seal ring in the gap which surrounds the compliant body and which is spaced apart from the compliant body; and, the compliant body is intentionally compressed so much that a portion of the liquid metal alloy is squeezed from the compliant body into the space between the compliant body and the seal ring. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.

REFERENCES:
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patent: 4233645 (1980-11-01), Balderes et al.
patent: 4381818 (1983-05-01), Sachar et al.
patent: 4823863 (1989-04-01), Nakajima et al.
patent: 5323294 (1994-07-01), Layton et al.
patent: 5459352 (1995-10-01), Layton et al.

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