Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2004-06-18
2010-02-16
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C361S704000, C361S719000, C257S714000, C257S715000, C174S015200, C165S080300, C165S080400, C165S104260
Reexamination Certificate
active
07663883
ABSTRACT:
A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped heat conductor for transferring heat to the heat dissipating part and an elastic member for imparting elasticity to the film-shaped heat conductor, the film-shaped heat conductor being formed from metal foil-type flexible heat pipes or carbon-based thermal conductive sheets.
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Notice of Reasons for Rejection dated Feb. 17, 2009, from the corresponding Japanese Application.
Notice of Reasons for Rejection dated Jun. 4, 2009, from the corresponding Japanese Application.
Iino Kazuhiro
Shirakami Takashi
Tada Yoshiaki
Ueda Satoshi
Yamazaki Naoya
Chervinsky Boris L
Fujitsu Limited
Katten Muchin & Rosenman LLP
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