Heat transfer mechanism for integrated circuit package

Details Heat transfer mechanism for integrated circuit package Heat transfer mechanism for integrated circuit package

1976-12-06

1978-05-30

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361387, 174 16HS, 357 81, H05K 720

Patent

active

040926974

ABSTRACT:
Heat is removed from silicon devices in an integrated circuit package by means of a thermal liquid material contained in a film mounted on the underside of a cover enclosing the integrated circuit device. The film is electrically non-conductive and the film with the enclosed thermal liquid material form a formable pillow such that after the chip/substrate are assembled, the cover with the film containing the thermal liquid material is placed over the substrate and sealed thereto in a manner such that the film comes into direct contact with the top of the chips mounted on the substrate. This provides a direct heat transfer from the chip through the film to the thermal liquid material out to the cover, which may be formed as a heat radiator.

REFERENCES:
patent: 3616533 (1971-11-01), Heap
patent: 3673306 (1972-06-01), Kirpatrick
IBM Tech. Disc. Bull., Chip Cooling, Ing, vol. 13, No. 5, Oct. 1970, p. 1060.
IBM Tech. Disc. Bull., External Module Heat Sink Fastened to Board, Cunavelis, vol. 14, No. 1, Jun. 1964, p. 182.

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