Heat-transfer label including a phenoxy adhesive layer

Details Heat-transfer label including a phenoxy adhesive layer Heat-transfer label including a phenoxy adhesive layer

1998-11-10

2000-07-04

Zirker, Daniel

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428349, 428354, 428914, 156240, 156239, B32B 706, B32B 712, B44C 116

Patent

active

060836202

ABSTRACT:
A heat-transfer label well-suited for use in decorating silane-treated glass articles. In a preferred embodiment, the label exhibits good scuff resistance, is capable of withstanding pasteurization conditions on a silane-treated glass article and includes (a) a support portion in the form of a sheet of paper overcoated with a release layer of polyethylene, (b) a skim coat of wax overcoated onto the polyethylene release layer and (c) a transfer portion, the transfer portion including a cross-linked phenoxy protective lacquer layer printed onto the skim coat, a polyester ink layer printed onto the protective lacquer layer, and an adhesive layer printed onto the ink layer, as well as onto any exposed portions of the underlying protective lacquer layer and onto a surrounding area of the skim coat. The cross-linked phenoxy resin comprises a solvent-soluble phenoxy resin of the formula ##STR1## wherein the solvent-soluble phenoxy resin is cross-linked by a melamine formaldehyde resin. The adhesive layer comprises a phenoxy resin of the type present in a water-based phenoxy resin dispersion. The adhesive layer is preferably made by gravure printing onto its underlying layers an adhesive composition comprising the water-based phenoxy resin dispersion, isopropyl alcohol and water, and then evaporating the volatile components of the composition to leave an adhesive phenoxy film.

REFERENCES:
patent: 4548857 (1985-10-01), Galante
patent: 4927709 (1990-05-01), Parker et al.
patent: 4935300 (1990-06-01), Parker et al.
patent: 5049608 (1991-09-01), Medina
patent: 5800656 (1998-09-01), Geurtsen et al.
patent: 5824176 (1998-10-01), Stein et al.
Technical literature for UCAR Phenoxy Resin PKHH, Union Carbide Corp., Hackensack, NJ, publicly available before the filing of the present application.
Technical literature for CYMEL 370, Cytec Industries, Inc., West Paterson, NJ, publicly available before the filing of present appln.
Technical literature for PAPHEN PKHW-34, InChem, Corp., South Carolina publicly available before the filing of the present application.

Affiliated with

Also associated with

Rating

Heat-transfer label including a phenoxy adhesive layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-transfer label including a phenoxy adhesive layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-transfer label including a phenoxy adhesive layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1484315