Heat-transfer interface device between a source of heat and...

Heat exchange – Heat transmitter

Reexamination Certificate

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C165S080300, C428S403000, C428S421000

Reexamination Certificate

active

07137444

ABSTRACT:
What is proposed is a heat-transfer interface device for use in a range of up 320° C. working temperatures for transfer of heat from a source of heat to a heat-receiving object under severe conditions. The device comprises an elastomeric material filled with an electrically-nonconductive and thermally-conductive filler material. The elastomeric material may have recesses on the surface or the surface may be curved, e.g., on the side facing the source of heat for forming a space between the surface of the device and the mating surface of the source of heat. The elastomeric material is clamped between the heat source and heat receiver in a compressed state so that when it is expanded under the effect of an increased temperature, the material is redistributed and the recesses are flattened. The elastomeric material comprises perfluoroelastomer polymer, and the filler can be selected from boron nitride, aluminum nitride, beryllium oxide, etc. If necessary, a combined mixing-assisting and compression-set reducing agent in the form of perfluoropolyether can be added.

REFERENCES:
patent: 4654754 (1987-03-01), Daszkowski
patent: 4782893 (1988-11-01), Thomas
patent: 5281324 (1994-01-01), Kiesele et al.
patent: 5545473 (1996-08-01), Ameen et al.
patent: 5660917 (1997-08-01), Fujimori et al.
patent: 5679457 (1997-10-01), Bergerson
patent: 5783862 (1998-07-01), Deeney
patent: 5945217 (1999-08-01), Hanrahan
patent: 6054198 (2000-04-01), Bunyan et al.
patent: 6165612 (2000-12-01), Misra
patent: 6365063 (2002-04-01), Collins et al.
patent: 6376385 (2002-04-01), Lilleland et al.
patent: 6422172 (2002-07-01), Tanaka et al.
patent: 2003/0077454 (2003-04-01), Jing
“Industrial Plasma Engineering” by J.Reece Roth, vol. 1, Institute of Physics Publishing, 1995, pp. 412-413.
T-gon 200 Series Isulators of Thermagon, Inc., OH, USA.
Catologs of Mold-Tech, Standex-Engrooving group.

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