Heat transfer insulated parts and manufacturing method thereof

Coating processes – Electrical product produced – Metal coating

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Details

4271261, 4271264, 4272551, 427405, 4274197, 427529, 427530, C23C 1600

Patent

active

053566610

ABSTRACT:
A heat transfer insulated part including a heat transfer substrate formed of a sintered metal of Cu-W or Cu-Mo, an insulating ceramic layer for electrically insulating the heat transfer substrate, formed of ceramic such as Al.sub.2 O.sub.3, SiO.sub.2 and Si.sub.3 N.sub.4, and a barrier layer provided between the heat transfer substrate and an insulating ceramic layer composed of at least either one of metal layers of W and Mo. Furthermore, preferably, an intermediate layer composed of titanium carbide and/or titanium nitride and so forth for enhancing the adhesive property between the insulating ceramic layer and the barrier layer is provided.

REFERENCES:
patent: 3604970 (1971-09-01), Culbertson
patent: 3697343 (1972-10-01), Cuomo
patent: 4401719 (1983-08-01), Kobayashi
patent: 4480010 (1984-10-01), Sasanuma
patent: 4532190 (1985-07-01), Kanbe
patent: 4598025 (1986-07-01), Mizuhara
patent: 4777060 (1988-10-01), Mayr
patent: 4994301 (1991-02-01), Kusumoto
patent: 5079089 (1992-01-01), Ito
patent: 5192410 (1993-03-01), Ito
patent: 5192589 (1993-03-01), Sandhu
M. Fukutomi et al "Silicon Nitride Coatings on Molybdenum by RF Reactive Ion Plating". J. Electrochem. Soc. vol. 124, No. 9 Sep. 1977, pp. 1420-1424.
M. Kobayashi et al "TiN and TiC Coating on Cemented Carbides by Ion Plating" Thin Solid Films 54, 1978, pp. 67-74.

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