Heat transfer device for use with a heat sink in removing therma

Details Heat transfer device for use with a heat sink in removing therma Heat transfer device for use with a heat sink in removing therma

1992-12-16

1993-12-14

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165185, 174 163, 257707, 257713, 361702, H05K 720

Patent

active

052709027

ABSTRACT:
A heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip. The inventive device includes a first membrane of flexible, thermally conductive material having a first surface in contact with the integrated circuit chip. A flexible, thermally conductive radial finger contact spring is disposed in contact with a second surface of the first membrane. A second membrane of flexible, thermally conductive material is included. The second membrane has a first surface in contact with the spring and a second surface in contact with the heat sink.

REFERENCES:
patent: 4156458 (1979-05-01), Chu
patent: 4235283 (1980-11-01), Gupta
patent: 4471837 (1984-09-01), Larson
patent: 5006924 (1991-04-01), Frankeny
patent: 5022462 (1991-06-01), Flint
patent: 5168348 (1992-12-01), Chu
"Circuit Module . . . Transfer", IBM Tech. Discl. Bull. vol. 20, No. 6, Nov. 1977, Nuccio et al, p. 2329 (361-386).
"New . . . Cooling", IBM Tech. Disc. Bull. vol. 28 No. 12 May 1986, pp. 5504, 5505.

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