Heat transfer device for a retention assembly

Details Heat transfer device for a retention assembly Heat transfer device for a retention assembly

1999-05-26

2000-06-13

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361702, 361707, 361717, 361725, 361741, 361754, 257707, 257713, 257726, 165 803, 165185, 174 161, 174 163, H05K 720

Patent

active

060757027

ABSTRACT:
A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.

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Intel, "S.E.C.C.2 Heat Sink Installation and Removal Process" (Application Note); Dec. 1998; pp. 1-13; http://www/intel.com.
Intel, "Single Edge Processor Package (SEPP) with the Intel.RTM. Celerom.TM. Processor", (Manufacturing Advantage Tips); 1999; pgs. (9); http://www/intel.com.

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