Heat transfer device and method

Details Heat transfer device and method Heat transfer device and method

1991-04-17

1992-05-05

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 802, 165185, H05K 720

Patent

active

051113597

ABSTRACT:
A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improved thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the core of the board may be parallel to the mounting surface of the core throughout their length. The device may include at least two thermally conductive wedges embedded in the core for conducting heat into and out of the interior of the core. The wedges may be milled metal that may be mechanically and/or thermally attached to the composite material. The wedges may also be chemically plated to the composite. A plurality of the fibers contact both wedges to conduct heat to a surface adapted to transfer heat to the sink. A method of manufacture of the device provides that cavities for the wedges may be milled in the composite material of the core.

REFERENCES:
patent: 4849858 (1989-07-01), Grapes et al.
patent: 4867235 (1989-09-01), Grapes et al.

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