Heat exchange – Heat transmitter
Patent
1993-02-10
1994-05-31
Rivell, John
Heat exchange
Heat transmitter
257720, 361704, 361707, 361713, F28F 700, H05K 720
Patent
active
053160800
ABSTRACT:
Gas derived graphite fibers generated by the decomposition of an organic gas are joined with a suitable binder. This produces a high thermal conductivity composite material which passively conducts heat from a source, such as a semiconductor, to a heat sink.
The fibers may be intercalated. The intercalate can be halogen or halide salt, alkaline metal, or any other species which contributes to the electrical conductivity improvement of the graphite fiber.
The fibers are bundled and joined with a suitable binder to form a high thermal conductivity composite material device. The heat transfer device may also be made of intercalated highly oriented pyrolytic graphite and machined, rather than made of fibers.
REFERENCES:
patent: 3543842 (1970-12-01), Merges
patent: 3609992 (1971-10-01), Cacheux
patent: 3969754 (1976-07-01), Kuniya et al.
patent: 4161747 (1979-07-01), Jennings
patent: 4318954 (1982-03-01), Jensen
patent: 4415025 (1983-11-01), Horvath
patent: 4470063 (1984-09-01), Arakawa et al.
patent: 4482912 (1984-11-01), Chiba et al.
patent: 4485429 (1984-11-01), Mittal
patent: 4591659 (1986-05-01), Leibowitz
patent: 4630174 (1986-12-01), Kaufman
patent: 4749514 (1988-06-01), Murakami et al.
patent: 4816289 (1989-03-01), Komatsu et al.
patent: 4849858 (1989-07-01), Grapes et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 4933804 (1990-06-01), Bertenshaw et al.
patent: 4985805 (1991-01-01), Riedel et al.
patent: 5077637 (1991-12-01), Martorana et al.
patent: 5212625 (1993-05-01), Van Andel et al.
patent: 5224030 (1993-06-01), Banks et al.
Ciancanelli, J. M. "Circuit Module with Heat Transfer", IBM Tech. Discl. Bull., vol. 19, No. 7, p. 2652, Dec. 1976.
"Thermal Conductivity"--Carbon Fibers; Ching-Cheh Hung, Carbon vol. 25, No. 5, pp. 679-684, Feb. 1987.
Banks Bruce A.
Gaier James R.
Leo L. R.
Mackin James A.
Miller Guy M.
Rivell John
Shook Gene E.
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