Heat transfer cold plate arrangement

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S168000, C361S699000, C361S702000

Reexamination Certificate

active

06230791

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates to heat transfer cold plates for removing heat from electrical components and the like.
The Iversen U.S. Pat. No. 5,111,280 shows a cooling arrangement for semiconductor devices consisting of a plurality of plates on which the semiconductor devices are mounted, each plate having flow paths for cooling fluid extending between opposite ends of the plate and having terminals for one of three legs of a three-phase electrical system. Coolant supply and discharge manifolds made of electrically insulating material, such as ceramic or plastic, are affixed to the ends of the plates to circulate cooling fluid through the passages in the plates and to the spaces between the plates, using dielectric coolants such as fluorocarbons to assure electrical insulation. The specification does not describe the attachment of the manifold to the metal plates.
The Iverson et al. U.S. Pat. No. 4,989,070 discloses a modular heat sink structure which includes a metal heat sink having semiconductor devices supported through insulating joints from adjacent surfaces of the heat sink and a coolant flow path extending beneath the insulated supports for the semiconductor devices from an inlet opening at one end of the plate to an outlet opening at the same end of the plate.
The Patent to Wolgemoth et al. U.S. Pat. No. 4,453,911 discloses a cold plate arrangement in which a cold plate made of plastic material has a coolant flow path extending from one end to the opposite end which directs coolant along the surfaces of power electronic components mounted on one side of the cold plate.
In the Sumikawa et al. U.S. Pat. No. 4,266,604, a heat exchanger such as a hot water radiator for an automobile consists of a plurality of metal tubes having metal plates mounted between tanks made of rust proof synthetic resin.
The mounting of heat transfer plates on which electrical or electronic components are affixed so as to not only isolate the heat transfer plates and/or components electrically but also to prevent stray electrical currents from traveling between the plates and the mounting presents a problem.
SUMMARY OF THE INVENTION
Accordingly it is an object of the present invention to provide a heat transfer cold plate arrangement which overcomes disadvantages of the prior art.
Another object to the invention is to provide a heat transfer cold plate arrangement having a simple and convenient construction.
These and other objects of the invention are attained by providing a heat transfer cold plate arrangement including a cold plate which is electrically isolated from its surroundings by nonmetallic electrically insulating headers disposed at opposite ends of the cold plate to direct coolant to flow in two directions through the cold plate from an inlet in one header to a return header and back to an outlet in the first header and in which the assembly is supported by one or more mounts attached to the insulating headers.
In one embodiment, the cold plate arrangement includes a metal plate having an array of parallel internal channels extending between opposite end surfaces and nonmetallic headers made of electrically insulating composite material attached to the opposite ends of the metal plate, one of the headers providing inlet and outlet fluid flow paths and the other header providing flow communication between the cold plate channels supplied by the inlet flow path and the channels connected to the outlet flow path. The headers may be sealingly attached to the ends of the metal plate by adhesive or by snap-in connections with compressed gasketing. Heat-generating components to be cooled are mounted on the metal plate, for example, by threaded holes in the surfaces of the plate. To provide electrical isolation from adjacent components, the assembly is supported by feet which are attached to the insulating headers.


REFERENCES:
patent: 4266604 (1981-05-01), Sumikawa et al.
patent: 4420739 (1983-12-01), Herren
patent: 4758926 (1988-07-01), Herrell et al.
patent: 4939624 (1990-07-01), August et al.
patent: 4989070 (1991-01-01), Iversen et al.
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5014904 (1991-05-01), Morton
patent: 5043797 (1991-08-01), Lopes
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5111280 (1992-05-01), Iversen
patent: 5453911 (1995-09-01), Wolgemuth et al.
patent: 5636684 (1997-06-01), Teytu et al.
patent: 5973261 (1999-10-01), Chevallet et al.
patent: 6039114 (2000-03-01), Becker et al.
patent: 0508717 (1992-07-01), None
patent: 0858107 (1998-01-01), None
patent: 0930815 (1999-01-01), None
patent: WO97/25741 (1997-07-01), None
European Search Report.
English language abstract of EP 930815.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat transfer cold plate arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat transfer cold plate arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat transfer cold plate arrangement will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2446438

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.