Heat transfer bag with thermal via

Details Heat transfer bag with thermal via Heat transfer bag with thermal via

1990-07-20

1991-03-19

Davis, Jr., Albert W.

Heat exchange

Flexible envelope or cover type

16510419, 16510433, 165 804, 361385, 174 151, H01L 23473, F28D 1500

Patent

active

050002562

ABSTRACT:
A heat transfer bag especially useful for cooling electronic components is made of a flexible sheet of material and is filled with a fluorochemical heat transfer liquid. A metallic thermal via extends through a hole in the bag for direct contact with an external surface of a heat-generating component. A portion of the via extends into the bag and functions as a heat radiating fin to enhance the transfer of heat from the component to the liquid within the bag.

REFERENCES:
patent: 2780757 (1957-02-01), Thornhill et al.
patent: 3826957 (1974-07-01), McLaughlin et al.
IBM Technical Bulletin, Thermal Enhancement of Modules, vol. 19, No. 8, 1/1977.
IBM Technical Bulletin, Convection Cooling in Small Terminals, vol. 24, No. 2, 7/1981.

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