Heat transfer arrangement

Refrigeration – Gas controller or director – Cooled gas directed relative to cooled enclosure

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 83, F25D 1704

Patent

active

045948623

ABSTRACT:
A cooling arrangement for electronic components mounted in racking systems in which access to the components is gained by moving a rack with reference to its supporting structure comprises a thin-walled cooling chamber of shallow depth carried by a fixed structure and arranged to be urged against and to conform with a wall of the rack, a pressurized liquid coolant being passed through the cooling chamber in the form of a lamina flow sheet to provide efficient cooling, the chamber being urged into its conformal position by an expandable chamber which is itself expanded by the pressurized coolant. Coolant is firstly used to expand the expandable chamber and then is ducted from that chamber into the cooling chamber from which it exits for subsequent recycling.

REFERENCES:
patent: 2444887 (1948-07-01), Wyeth
patent: 2449101 (1948-09-01), Barley
patent: 4072188 (1978-02-01), Wilson et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat transfer arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat transfer arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat transfer arrangement will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2266880

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.