Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-20
1998-11-03
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 361709, 361720, 361753, 165 801, 165185, 174 163, 174 51, 257717, 379428, 379429, H05K 720
Patent
active
058318267
ABSTRACT:
A heat transfer apparatus is carried on a substrate (204) having top and bottom surfaces (212, 214). The heat transfer apparatus includes a pad (220/222), at least one via (224/226), and a plurality of pads (302). The pad (220/222) is carried on the top surface (212) of the substrate (204) to electrically connect to an electronic component (228/230). The via (224/226) intersects the pad (220/222) and extends between the top and bottom surfaces (212, 214) of the substrate (204). The plurality of pads (302) are carried on the bottom surface (214) of the substrate (204) beneath the pad (220/222). The via (224/226) intersects one of the plurality of pads (302) to transfer heat generated during operation of the electronic component (228/230) thereto.
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Photograph of a power amplifier module and associated ground pad employed in a 3W transceiver module manufactured and sold by Motorola, Inc on Jan. 22, 1987 as part of a mobile cellular telephone.
Chervinsky Boris L.
Motorola Inc.
Patrick Mark D.
Picard Leo P.
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