Heat transfer apparatus and method of manufacturing an...

Heat exchange – With retainer for removable article – Electrical component

Reexamination Certificate

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Details

C165S185000, C361S704000, C257S719000

Reexamination Certificate

active

06945313

ABSTRACT:
A method for cooling integrated circuit assemblies uses a heat sink having a base and a displacement element having a size substantially similar to an area of heat concentration appropriately positioned on the integrated circuit. A compressive force placed upon the displacement element between the heat sink and the integrated circuit provides an optimum thermal resistance at an interface between the IC and the heat sink for efficient transfer of heat to the heat sink.

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