Heat stake press and aligner and method of use

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article

Patent

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Details

29464, 292435, 29509, 425392, 425403, B29C 6518

Patent

active

053688023

ABSTRACT:
A heat stake press apparatus is described for fixing a connecter to a circuit board by heat staking pegs of the connector, which facilitates alignment of the circuit board holes with forming tips in a low cost press. A pair of aligners (110, 112, FIG. 6 ) is provided that are each mounted at a forward edge of the board in alignment with a peg hole (22) of the board. The board is mounted on support guides (62, 64) of the press, and the board is slid forwardly until a pair of forming tips (52) are received in slots (124) of the aligners to sidewardly align the board. The support guides are then moved sidewardly so board guide pins (74A, 76A, FIG. 2 ) move against side edges (80, 82) of the board. Thereafter, the aligners are removed, a connector (14) is placed on the board with its pegs projecting down through the board holes, and the board is again placed in the press on the support guides. A pressing mechanism (90) of the press is then operated to move an arbor (92) down against the connector to push down the connector and circuit board until the connector pegs are pushed down against the hot forming tips (52) that heat stake them. During downward movement of the connector and board, the support guides move down towards bases (100, 102) that support them by springs (106).

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patent: 5046953 (1991-09-01), Shreeve et al.
patent: 5227173 (1993-07-01), Sherwood

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