Heat spreaders with vias

Details Heat spreaders with vias Heat spreaders with vias

2007-12-04

2007-12-04

Walberg, Teresa J. (Department: 3744)

Heat exchange

Heat transmitter

C165S080200, C029S890100

Reexamination Certificate

active

11339338

ABSTRACT:
Constructions for and methods of manufacturing graphite heat spreaders having thermal vias placed therethrough are provided. Thermal vias having one or two flanges are disclosed, as are flush thermal vias. Graphite heat spreaders having surface layers covering the graphite material are provided. Graphite heat spreaders having a layer of cladding for increased structural integrity are provided. Also disclosed are methods of co-forging a graphite heat spreader element with a metal thermal via in place therein.

REFERENCES:
patent: 3404061 (1968-10-01), Shane et al.
patent: 3678995 (1972-07-01), Collard
patent: 4234638 (1980-11-01), Yamazoe et al.
patent: 4782893 (1988-11-01), Thomas
patent: 4812792 (1989-03-01), Leibowitz
patent: 4878152 (1989-10-01), Sauzade et al.
patent: 4895713 (1990-01-01), Greinke et al.
patent: 4961991 (1990-10-01), Howard
patent: 5192605 (1993-03-01), Mercuri et al.
patent: 5224030 (1993-06-01), Banks et al.
patent: 5255738 (1993-10-01), Przilas
patent: 5287248 (1994-02-01), Montesano
patent: 5316080 (1994-05-01), Banks et al.
patent: 5366688 (1994-11-01), Terpstra et al.
patent: 5509993 (1996-04-01), Hirschvogel
patent: 5542471 (1996-08-01), Dickinson
patent: 5660917 (1997-08-01), Fujimori et al.
patent: 5718566 (1998-02-01), Ikeda et al.
patent: 5902762 (1999-05-01), Mercuri et al.
patent: 5944097 (1999-08-01), Gungor et al.
patent: 5958572 (1999-09-01), Schmidt et al.
patent: 6027807 (2000-02-01), Inoue et al.
patent: 6060166 (2000-05-01), Hoover et al.
patent: 6075701 (2000-06-01), Ali et al.
patent: 6131651 (2000-10-01), Richey, III
patent: 6141216 (2000-10-01), Holung et al.
patent: 6208513 (2001-03-01), Fitch et al.
patent: 6503626 (2003-01-01), Norley et al.
patent: 6538892 (2003-03-01), Smalc
patent: 6555223 (2003-04-01), Kubo
patent: 6673289 (2004-01-01), Reynolds, III et al.
patent: 6706400 (2004-03-01), Mercuri et al.
patent: 6749010 (2004-06-01), Getz, Jr. et al.
patent: 6758263 (2004-07-01), Krassowski et al.
patent: 6771502 (2004-08-01), Getz, Jr. et al.
patent: 6886249 (2005-05-01), Smalc
patent: 6930885 (2005-08-01), Barcley
patent: 2002/0039749 (2002-04-01), Wu et al.
patent: 2002/0157819 (2002-10-01), Norley et al.
patent: 2003/0019104 (2003-01-01), Smalc
patent: 2003/0116312 (2003-06-01), Krassowski et al.
PCT/US02/39749 Published Jun. 26, 2003, WO 03/051772.
European Patent Application No. 95104171.4, Publication No. 0673900, filed Mar. 22, 1995.
Exhibit “A”—webpage for Radian Heatsinks—Standard Heatsink Products.
Exhibit “A”—webpage for Arkua Cooler; Special Design for Intel P4 Socket 423/478; Intel PIII PGA 370; AMD Socket 462.

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