Heat spreader with vapor chamber defined therein

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080200, C165S104330, C257S715000

Reexamination Certificate

active

07609520

ABSTRACT:
A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.

REFERENCES:
patent: 6901994 (2005-06-01), Jin-Cherng et al.
patent: 7032652 (2006-04-01), Wang et al.
patent: 7109581 (2006-09-01), Dangelo et al.
patent: 7447029 (2008-11-01), Lai et al.
patent: 2004/0016534 (2004-01-01), Lai
patent: 2005/0092467 (2005-05-01), Lin et al.
patent: 2005/0092469 (2005-05-01), Huang
patent: 2007/0068654 (2007-03-01), Chang
patent: 2007/0095652 (2007-05-01), Knowles et al.
patent: 2007/0158052 (2007-07-01), Lin
patent: 2007/0284089 (2007-12-01), Vadakkanmaruveedu et al.
patent: 2008/0128116 (2008-06-01), Dangelo et al.
patent: 2008/0283222 (2008-11-01), Chang et al.
patent: 1681381 (2005-10-01), None

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