Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-04-10
1999-07-06
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361702, 361704, 361761, 361767, 174 163, 174252, 165 802, 165 803, H05K 702
Patent
active
059204621
ABSTRACT:
There is disclosed herein a printed circuit board onto which an electronic component heat spreader may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.
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Baker Jay DeAvis
Glovatsky Andrew Zachary
Sinkunas Peter Joseph
Chervinsky Boris L.
Ford Motor Company
Hodges Leslie C.
Picard Leo P.
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