Heat spreader in integrated circuit package

Details Heat spreader in integrated circuit package Heat spreader in integrated circuit package

2008-09-02

2008-09-02

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S710000, C361S783000

Reexamination Certificate

active

10873387

ABSTRACT:
An integrated circuit (IC) package comprises a package substrate, an IC die mounted on the package substrate, a wire bond electrically connecting the IC die and the package substrate, and a heat spreader mounted on the package substrate. The heat spreader comprises a hole through a portion thereof. The IC die and the wire bond are disposed substantially between the heat spreader and the package substrate.

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