Heat spreader for memory modules

Details Heat spreader for memory modules Heat spreader for memory modules

2009-11-12

2010-11-23

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S710000, C361S711000, C361S719000, C165S080200, C165S185000, C174S016100, C174S016300, C257S713000, C257S718000, C257S719000, C257SE23101, C257SE23105

Reexamination Certificate

active

07839643

ABSTRACT:
A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit on the first side. The heat spreader further includes a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.

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Shawn Hall et al., “Low-Cost, High Performance Heatsinks for Closely Spaced DIMMs,” presentation to JEDEC, Dec. 5, 2006.

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