Electric lamp and discharge devices: systems – Combined load device or load device temperature modifying... – Load device temperature-modifying means combined with or...
Patent
1997-07-30
2000-07-18
Vu, David H.
Electric lamp and discharge devices: systems
Combined load device or load device temperature modifying...
Load device temperature-modifying means combined with or...
315 56, 361720, H01J 724
Patent
active
060911999
ABSTRACT:
An insulating enclosure for an electronic ballast has at least one major surface and a thermally conductive heat spreader at the major surface. The heat spreader is thermally coupled to at least one of the electronic components within the ballast and has an area greater than the area of the component as measured parallel with the major surface. The electronic components are thermally coupled to the heat spreader by a thermally conductive, deformable means such as caulk or by domes or dimples in the heat spreader that accommodate the variations in height among the electronic components. An electrically insulating layer can be located between the heat spreader and some of the components to prevent the heat spreader from electrically shorting the components.
REFERENCES:
patent: 2711382 (1955-06-01), Smith-Johannsen
patent: 4738024 (1988-04-01), Eberhardt
patent: 5015803 (1991-05-01), Mahulikar et al.
patent: 5307236 (1994-04-01), Rio et al.
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5629581 (1997-05-01), Belle et al.
Gottlieb, Irving M., The all-important matter of thermal conductivity, McGraw-Hill,Inc.,pp 101, 1992.
Crouse Kent E.
Van Pelt James Neal
Energy Savings, Inc.
Vu David H.
Wille Paul F.
LandOfFree
Heat spreader for electronic ballast does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat spreader for electronic ballast, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat spreader for electronic ballast will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2039988