Compositions – Heat-exchange – low-freezing or pour point – or high boiling... – Organic components
Reexamination Certificate
2005-05-24
2005-05-24
Gupta, Yogendra N. (Department: 1751)
Compositions
Heat-exchange, low-freezing or pour point, or high boiling...
Organic components
C252S071000, C252S074000, C252S503000, C252S506000, C252S508000, C252S511000, C252S512000, C252S513000, C252S514000, C252S515000, C338S0220SD
Reexamination Certificate
active
06896824
ABSTRACT:
A heat-softening heat-radiation sheet including a polyolefin-based heat-conductive composition which comprises a polyolefin and a heat-conductive filler, has a softening point of 40° C. or above, has a thermal conductivity of 1.0 W/mK or higher, has a viscosity at 80° C. of from 1×102to 1×105Pa·s and has a plasticity at 25° C. in the range of from 100 to 700. This heat-radiation sheet which is in the form of a solid sheet at room temperature, can readily be attached to or detached from electronic components and a heat sink, is capable of softening by the heat generated during operation of electronic components, to have the interfacial contact thermal resistance at a negligible level, and has a superior heat-radiation performance.
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Derwent Publications. AN 1999-101208. JP 10-330575. Dec. 15, 1998.
Derwent Publications. AN 1993-232497. JP 05-156100. Jun. 22, 1993.
Handa Ryuichi
Tomaru Kazuhiko
Yoneyama Tsutomu
Gupta Yogendra N.
Hamlin D. G.
Shin-Etsu Chemical Co. , Ltd.
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